The world's largest memory chip maker said its next-generation 2.5D packaging technology, Interposer-Cube4 (I-Cube4), is expected to be widely used in areas like high-performance computing, artificial intelligence (AI), 5G, cloud and largest data center applicants as it creates enhanced communication and power efficiency between logic and memory chips.
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Wednesday, May 5, 2021
Samsung develops advanced chip packaging tech
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