But the newest race in chipmaking is to stack "chiplets" or "tiles" - tiny squares sliced out of what would normally be a single, larger chip - on top of a base layer of silicon in one package, mixing and matching different technologies rather than trying to make a single big chip.
from Latest Telecom News | Latest Telecom Industry News, Information and Update: ET Telecom : ETTelecom.com https://ift.tt/3BN7Pjw
Monday, July 26, 2021
Intel banks on 3D chip technology to win over new customers
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