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Thursday, August 11, 2022

SK Hynix to break ground on new U.S. chip packaging plant early next year: Sources

The plant, whose estimated cost would be "several billions," would ramp up to mass production by 2025-2026 and employ about 1,000 workers, one of the sources said, declining to be named because the details surrounding the plant have not been made public.

from Latest Telecom News | Latest Telecom Industry News, Information and Update: ET Telecom : ETTelecom.com https://ift.tt/joLUiZl

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